Wafer Depositing

Wafers should be automatically deposited on a dough piece after a proofer. Thus, it is necessary to measure the position of the dough piece on a conveyor belt and apply previously isolated wafers via a handling unit. Wafers are applied in a robotic cell with the help of two delta robots. Before proceeding to the robot cell the dimensions of the dough pieces are measured using a 3D image processing system (diameter and height).Wafers are retrieved from the tunnel system and placed at a defined position.Once dough pieces pass through the robot's work envelope, wafers are picked up from the start position by a multi-gripper and placed in the center of the dough pieces.Based on the dough pieces' coordinates provided by the image processing system to the robot system, wafers are placed sequentially. The center and the height of each dough piece can be corrected by the robot.